Project Background

Integrated circuit packaging is the process of connecting a chip with an external connector to protect the chip from physical and chemical damage and improve the performance and reliability of the chip. Integrated circuit packaging is an important link in the semiconductor industry chain and plays an important role in enhancing the added value and competitiveness of integrated circuits.

With the rapid development of the Internet of Things, intelligent terminals, automotive electronics, industrial control and other fields, the integrated circuit packaging industry is facing huge market demand and technical challenges.2020Sales revenue of China's integrated circuit packaging industry reached2509.5Billion yuan, year-on-year growth6.8%. expected2026year, the market share will break through4000billion yuan,2020-2026年间年均复合增长率将达到10%Left and right.

Customer pain points

Shangpu Consulting is a company specializing in industrial market research and consulting services, with many years of industry experience and professional team. The client of Shangpu Consulting is an integrated circuit packaging company, mainly engaged in.BGA、PGA、WLP、CSPand other high-end advanced packaging forms of production and sales. The enterprise occupies a certain share in the domestic market, but faces the following problems:

集成电路封装行业竞争激烈，同质化现象严重，产品差异化不明显，价格压力大。

The technology of integrated circuit packaging industry is updated rapidly, and new technologies are emerging, such as metal bump technology, flip chip technology, through silicon via technology and stacked chip packaging technology, which require continuous investment in research and development and equipment renewal, increasing costs and risks.

The integrated circuit packaging industry is affected by downstream market demand, and needs to keep abreast of market dynamics and changes in customer demand, and formulate reasonable market strategies and marketing plans.

Project Purpose

20235月，为了帮助客户解决上述问题，提升客户在集成电路封装行业的竞争力和盈利能力，尚普咨询公司开展了集成电路封装行业市场需求分析与竞争策略项目。该项目的主要目的是：

分析集成电路封装行业的市场规模、结构、趋势、机会和挑战，评估客户在行业中的地位和优势。

分析集成电路封装行业的主要竞争对手，包括其产品特点、价格策略、渠道布局、营销手段等，评估客户在行业中的竞争力和差异化程度。

Analyze the main customer groups in the integrated circuit packaging industry, including their demand characteristics, purchase behavior, decision-making process, etc., and evaluate the market potential and satisfaction of customers.

Based on the above analysis, to provide customers with targeted marketing strategies and marketing recommendations, including product innovation, price optimization, channel expansion, brand enhancement, etc., to help customers improve market share and profit margins.

Research object

The research object of the project mainly includes the following two categories:

The main competitors in the integrated circuit packaging industry were selected.10家，分别是长电科技、通富微电、华天科技、晶方科技、太极实业、苏州固锝、深科技等国内企业，以及ASE、Amkor、SPIL等国外企业。

The main customer groups in the integrated circuit packaging industry were selected.100家，分别是华为、中兴、小米、OPPO、VIVO等手机厂商，以及海思、联发科、高通、英特尔等芯片厂商。

Project Content

The main contents of the project include the following aspects:

Through literature collection and web search, obtain relevant data and information about the IC packaging industry, such as market size, structure, trends, opportunities and challenges.

通过电话访谈和问卷调查，获取竞争对手和客户群体的相关数据和信息，如产品特点、价格策略、渠道布局、营销手段、需求特点、购买行为、决策过程等。

通过数据整理和分析，对集成电路封装行业的市场现状和竞争格局进行评估，对客户在行业中的地位和优势进行评估。

通过数据对比和归纳，对竞争对手和客户群体进行分析，对客户在行业中的竞争力和差异化程度进行评估。

Through data mining and modeling, the market demand of integrated circuit packaging industry is predicted, and the market potential and satisfaction of customers are evaluated.

基于以上分析结果，为客户提供针对性的市场策略和营销建议。

Project Value

The project provides value to the customer in the following areas:

Help customers fully understand the market status and development trends of the integrated circuit packaging industry, and grasp the opportunities and challenges of the industry.

帮助客户深入了解竞争对手和客户群体的特点和需求，提升客户的市场敏感度和反应能力。

帮助客户准确评估自身在行业中的地位和优势，明确自身的目标和方向。

帮助客户制定合理有效的市场策略和营销方案，提升客户的市场占有率和利润率。

帮助客户增强自身的产品创新能力和品牌影响力，提升客户在行业中的核心竞争力。