Project Background

Integrated circuit packaging is the process of connecting a chip with an external connector to protect the chip from physical and chemical damage and improve the performance and reliability of the chip. Integrated circuit packaging is an important link in the semiconductor industry chain and plays an important role in enhancing the added value and competitiveness of integrated circuits.

With the rapid development of the Internet of Things, intelligent terminals, automotive electronics, industrial control and other fields, the integrated circuit packaging industry is facing huge market demand and technical challenges.2020Sales revenue of China's integrated circuit packaging industry reached2509.5Billion yuan, year-on-year growth6.8%. expected2026year, the market share will break through4000billion yuan,2020-2026The annual compound annual growth rate will reach10%Left and right.

Customer pain points

Shangpu Consulting is a company specializing in industrial market research and consulting services, with many years of industry experience and professional team. The client of Shangpu Consulting is an integrated circuit packaging company, mainly engaged in.BGA、PGA、WLP、CSPand other high-end advanced packaging forms of production and sales. The enterprise occupies a certain share in the domestic market, but faces the following problems:

The competition in the integrated circuit packaging industry is fierce, the homogenization phenomenon is serious, the product differentiation is not obvious, and the price pressure is high.

The technology of integrated circuit packaging industry is updated rapidly, and new technologies are emerging, such as metal bump technology, flip chip technology, through silicon via technology and stacked chip packaging technology, which require continuous investment in research and development and equipment renewal, increasing costs and risks.

The integrated circuit packaging industry is affected by downstream market demand, and needs to keep abreast of market dynamics and changes in customer demand, and formulate reasonable market strategies and marketing plans.

Project Purpose

20235In January, in order to help customers solve the above problems and enhance their competitiveness and profitability in the integrated circuit packaging industry, Shangpu Consulting conducted a project on market demand analysis and competitive strategy in the integrated circuit packaging industry. The main objectives of the project are:

Analyze the market size, structure, trends, opportunities and challenges of the integrated circuit packaging industry, and evaluate the position and advantages of customers in the industry.

Analyze the main competitors in the integrated circuit packaging industry, including their product characteristics, pricing strategies, channel layout, marketing methods, etc., and evaluate the competitiveness and differentiation of customers in the industry.

Analyze the main customer groups in the integrated circuit packaging industry, including their demand characteristics, purchase behavior, decision-making process, etc., and evaluate the market potential and satisfaction of customers.

Based on the above analysis, to provide customers with targeted marketing strategies and marketing recommendations, including product innovation, price optimization, channel expansion, brand enhancement, etc., to help customers improve market share and profit margins.

Research object

The research object of the project mainly includes the following two categories:

The main competitors in the integrated circuit packaging industry were selected.10home, respectively, Changdian Technology, Tongfu Micropower, Huatian Technology, Jingfang Technology, Taiji Industrial, Suzhou Solid Technology, Deep Technology and other domestic enterprises, as well.ASE、Amkor、GAMEand other foreign companies.

The main customer groups in the integrated circuit packaging industry were selected.100home, respectively, Huawei, ZTE, Xiaomi,OPPO、VIVOSuch as mobile phone manufacturers, as well as HiSilicon, MediaTek, Qualcomm, Intel and other chip manufacturers.

Project Content

The main contents of the project include the following aspects:

Through literature collection and web search, obtain relevant data and information about the IC packaging industry, such as market size, structure, trends, opportunities and challenges.

Through telephone interviews and questionnaires, obtain relevant data and information about competitors and customer groups, such as product characteristics, pricing strategies, channel layout, marketing tools, demand characteristics, purchase behavior, decision-making process, etc.

Through data collation and analysis, the market status and competitive landscape of the integrated circuit packaging industry are evaluated, and the position and advantages of customers in the industry are evaluated.

Through data comparison and induction, the competitors and customer groups are analyzed to evaluate the competitiveness and differentiation of customers in the industry.

Through data mining and modeling, the market demand of integrated circuit packaging industry is predicted, and the market potential and satisfaction of customers are evaluated.

Based on the above analysis results, to provide customers with targeted marketing strategies and marketing recommendations.

Project Value

The project provides value to the customer in the following areas:

Help customers fully understand the market status and development trends of the integrated circuit packaging industry, and grasp the opportunities and challenges of the industry.

Help customers gain insight into the characteristics and needs of competitors and customer groups, and enhance their market sensitivity and responsiveness.

Help customers accurately assess their position and advantages in the industry, and clarify their goals and directions.

Help customers to develop reasonable and effective marketing strategies and marketing programs to enhance their market share and profit margins.

Help customers to enhance their product innovation ability and brand influence, enhance the core competitiveness of customers in the industry.