1. Market Size Forecast of Electronic Special Equipment

According to data from the Champ Consulting Group,2022In, China's electronic special equipment market reached300Billion US dollars, year-on-year growth10%, of which the semiconductor equipment market size reached200Billion US dollars, year-on-year growth10%, the display device equipment market size reached70Billion US dollars, year-on-year growth10%The market size of printed circuit board equipment reached30Billion US dollars, year-on-year growth10%。2023In the first quarter of the year, the market size of China's electronic special equipment reached80Billion US dollars, year-on-year growth10%, of which the semiconductor equipment market size reached50Billion US dollars, year-on-year growth10%, the display device equipment market size reached18Billion US dollars, year-on-year growth10%The market size of printed circuit board equipment reached8Billion US dollars, year-on-year growth10%。

according to champ consulting,2023China's electronic special equipment market is expected to maintain a high growth trend, the full year is expected to reach.400About US $100 million, year-on-year growth35%Left and right. The main reasons are the following:

First of all, affected by the Sino-US trade friction and chip shortage, China has accelerated the development and localization of the semiconductor industry, and greatly increased the investment and demand for semiconductor equipment. According to data from the Champ Consulting Group,2021New built in China12Inch fabs have6Block, newly built8Inch fabs have4Block, newly built6Wafers of inches and below have5Seat.2022New built in China12Inch fabs have7Block, newly built8Inch fabs have3Block, newly built6Wafers of inches and below have4Seat.2023New construction is expected in China throughout the year.12Inch fabs have8Block, newly built8Inch fabs have2Block, newly built6Wafers of inches and below have3Seat. These new and expanded fabs will bring a large number of semiconductor equipment demand, driving the growth of the semiconductor equipment market.

Secondly,5GWith the development of new technologies and applications such as the Internet of Things, artificial intelligence, and new energy vehicles, the demand for display devices has also shown a trend of diversification and high-end, which has promoted the upgrading and innovation of display device equipment. Expected2023Year-round ChinaOLEDPanel capacity will reach1.2Billion square meters, year-on-year growth25%，LCDPanel capacity will reach1.8100 million square meters, down year-on-year5%。OLEDThe market share of the panel will increase from2021of the year28%Promote2023of the year40%Left and right. The display device equipment market will benefit fromOLEDhigh growth of panels andLCDStructural adjustment of the panel.

Thirdly, as the basic component of electronic products, the demand of printed circuit board is closely related to the development of electronic information industry. With the recovery and growth of consumer electronics, communications, automotive and other industries, the demand for printed circuit boards will also steadily increase. At the same time, with the progress of printed circuit board technology, high-density interconnection (HDI), rigid-flex combined plate (FPC), carrier plate (SIP) and other high-end products will also increase, driving the expansion of the printed circuit board equipment market.

In summary, we expect2023The market size of China's electronic special equipment is expected to reach400About US $100 million, year-on-year growth35%Left and right. Among them, the size of the semiconductor equipment market is expected to reach250About US $100 million, year-on-year growth33%The market size of display device equipment is expected to reach80About US $100 million, year-on-year growth24%The market size of printed circuit board equipment is expected to reach40About US $100 million, year-on-year growth43%Left and right.

2. Market demand analysis of electronic special equipment

2.1 Semiconductor Equipment Market Demand Analysis

Semiconductor equipment refers to equipment used in the manufacture, testing and testing of semiconductor materials, devices and integrated circuits, including front-end process equipment, back-end packaging and testing equipment and special application equipment. Semiconductor equipment is one of the most core and key links in the semiconductor industry chain, and its technical level and capacity scale directly affect the performance, quality and supply of semiconductor products.

According to data from the Champ Consulting Group,2022The size of the global semiconductor equipment market will reach1180Billion US dollars, year-on-year growth14.7%The market size of the former process equipment is880.1Billion US dollars, year-on-year growth23.3%The market size of the back-end packaging test equipment is147.8billion dollars, down year-on-year38.6%. Expected2023The global semiconductor equipment market will reach1200About US $100 million, year-on-year growth25%Left and right.

China is the world's largest semiconductor equipment market, accounting for more30%。2022China's semiconductor equipment market reached329.48Billion US dollars, year-on-year growth11.24%, accounting for the global market28.8%. Expected2023The size of China's semiconductor equipment market will reach250About US $100 million, year-on-year growth33%around, accounting for the global market20%Above.

China's semiconductor equipment market demand mainly comes from the following aspects:

Transformation and upgrading of domestic sealing plants. With the progress of integrated circuit technology and the expansion of application fields, packaging and testing technology is constantly innovating and developing towards high performance, high density, high reliability, low power consumption, low cost and so on. In order to adapt to market changes and improve competitiveness, domestic packaging and testing plants are also accelerating their transformation and upgrading, introducing and developing advanced packaging and testing technologies and equipment, such as embedded chip packaging (ECP), system-in-package (SIP), chip scale package (CSP), wafer-level packaging (WLP), etc. These advanced packaging and testing technologies and equipment will increase the demand for back-end packaging and testing equipment and promote the expansion of the market for back-end packaging and testing equipment.

The development of domestic special application areas. In addition to the traditional electronic information industry, semiconductor technology is also widely used in other special fields, such as aerospace, national defense, automotive electronics, medical equipment and so on. These special areas require higher performance, quality and reliability of semiconductor products, and require more professional and sophisticated semiconductor equipment to manufacture, test and inspect. With the country's attention and investment in these special areas, as well as the development and innovation of related industries, the demand for semiconductor equipment in special application areas will also increase, promoting the growth of the special application equipment market.

Market Demand Analysis of 2.2 Display Device Equipment

Display device equipment refers to the equipment used for the manufacture, testing and inspection of display devices (such as liquid crystal displays, organic light-emitting diodes, microdisplays, etc.), including front-end process equipment, back-end packaging test equipment and special application equipment. Display devices are an important part of the electronic information industry, and their technical level and capacity scale directly affect the performance, quality and supply of display products.

According to data from the Champ Consulting Group,2022The size of the global display device equipment market in120Billion US dollars, a year-on-year decrease of more9%, of which the market size of the former process equipment is approximately100Billion US dollars, down about10%The market size of the back-end packaging test equipment is approximately20Billion US dollars, down about9%。2023The global display device equipment market size in the first quarter of the year was approximately30Billion US dollars, up about10%, of which the market size of the former process equipment is approximately25Billion US dollars, up about10%The market size of the back-end packaging test equipment is approximately5Billion US dollars, up about10%. Expected2023The global display device equipment market size will reach260About US $100 million, year-on-year growth18%Left and right.

China is the world's largest display device equipment market, accounting for more40%。2022China's display device equipment market size reached800RMB billion, year-on-year growth12%, accounting for the global market26%。2023The size of China's display device equipment market in the first quarter200RMB billion, year-on-year growth10%, accounting for the global market25%。

China's display device equipment market demand mainly comes from the following aspects:

Construction and expansion of domestic panel factories. With5GWith the development of new technologies and applications such as the Internet of Things, artificial intelligence, and new energy vehicles, the demand for display devices has also shown a trend of diversification and high-end, which has promoted the upgrading and innovation of display device equipment.2023Year-round ChinaOLEDPanel capacity will reach1.2Billion square meters, year-on-year growth25%，LCDPanel capacity will reach1.8100 million square meters, down year-on-year5%。OLEDThe market share of the panel will increase from2021of the year28%Promote2023of the year40%Left and right. The display device equipment market will benefit fromOLEDhigh growth of panels andLCDStructural adjustment of the panel.

The development of domestic micro-display field. A microdisplay is one in which the diagonal is less1inch or pixel pitch less10Micron displays, mainly used in virtual reality (VR), Augmented Reality (AR), wearable devices, head-mounted displays and other fields. With the rapid development and innovation in these areas, the demand for microdisplays will also grow rapidly.2023The global microdisplay market size will reach40About US $100 million, year-on-year growth30%Left and right. China has a strong technological accumulation and market advantage in the field of microdisplays, and is expected2023The size of China's micro-display market will reach15About US $100 million, year-on-year growth35%around, accounting for the global market37.5%Left and right. The microdisplay device market will benefit from the rapid growth and localization of microdisplays.

The development of domestic special application areas. In addition to the traditional electronic information industry, display device technology is also widely used in other special fields, such as aerospace, national defense, medical equipment and so on. These special fields require higher performance, quality and reliability of display devices, and require more professional and sophisticated display device equipment to manufacture, test and inspect. With the country's attention and investment in these special areas, as well as the development and innovation of related industries, the demand for display devices in special application areas will also increase, driving the growth of the special application equipment market.

2.3 Printed Circuit Board Equipment Market Demand Analysis

Printed circuit board equipment refers to the equipment used for the manufacture, testing and inspection of printed circuit boards (such as single-sided boards, double-sided boards, multilayer boards, high-density interconnect boards, etc.), including front-end process equipment, back-end packaging test equipment and special application equipment. Printed circuit board is the basic component of electronic products, and its technical level and capacity scale directly affect the performance, quality and supply of electronic products.

According to data from the Champ Consulting Group,2022The size of the global printed circuit board equipment market in115.6Billion US dollars, year-on-year growth20.9%The market size of the former process equipment is92.5Billion US dollars, year-on-year growth20.9%The market size of the back-end packaging test equipment is23.1Billion US dollars, year-on-year growth20.8%。2023The global printed circuit board equipment market size in the first quarter31.4Billion US dollars, year-on-year growth19%The market size of the former process equipment is25.1Billion US dollars, year-on-year growth19%The market size of the back-end packaging test equipment is6.3Billion US dollars, year-on-year growth18.9%. Expected2023The global printed circuit board equipment market size will reach110About US $100 million, year-on-year growth15%Left and right.

China is the world's largest printed circuit board equipment market, accounting for more40%。2022The size of China's printed circuit board equipment market in30.9Billion US dollars, year-on-year growth49%, accounting for the global market30%. Expected2023The scale of China's printed circuit board equipment market will reach40About US $100 million, year-on-year growth43%around, accounting for the global market36%Above.

China's printed circuit board equipment market demand mainly from the following aspects:

Construction and expansion of domestic printed circuit board factories. With the recovery and growth of consumer electronics, communications, automotive and other industries, the demand for printed circuit boards will also steadily increase. At the same time, with the progress of printed circuit board technology, high-density interconnection (HDI), rigid-flex combined plate (FPC), carrier plate (SIP) and other high-end products will also increase, driving the expansion of the printed circuit board equipment market.2023China's printed circuit board production capacity will reach1.6Billion square meters, year-on-year growth10%, in whichHDI、FPC、SIPThe proportion of production capacity of high-end products such2021of the year30%Promote2023of the year40%Left and right.

Technological innovation in the field of domestic printed circuit boards. In order to adapt to market changes and improve competitiveness, domestic printed circuit board factories are also accelerating technological innovation and transformation and upgrading, introducing and developing advanced printed circuit board technology and equipment, such as direct molding (DMP), laser direct imaging (LDI), microporous drilling (MLD), micropore filling (MVF), embedded components (ECP), etc. These advanced printed circuit board technologies and equipment will increase the demand for front-end process equipment and back-end packaging test equipment, and promote the growth of the market for front-end process equipment and back-end packaging test equipment.

The development of domestic special application areas. In addition to the traditional electronic information industry, printed circuit board technology is also widely used in other special fields, such as aerospace, national defense, medical equipment, etc. These special areas have higher requirements for the performance, quality and reliability of printed circuit boards, and require more professional and sophisticated printed circuit board equipment to manufacture, test and inspect. With the country's attention and investment in these special areas, as well as the development and innovation of related industries, the demand for printed circuit board equipment in special application areas will also increase, promoting the growth of the special application equipment market.

3. Analysis of the competitive landscape of the electronic special equipment market

3.1 Semiconductor Equipment Market Competition Pattern Analysis

The competitive landscape of the semiconductor equipment market is still dominated by foreign manufacturers, but the market share of domestic manufacturers is expected to increase. According to the data of Shangpu Consulting Group, the top ten manufacturers in the global front road process equipment market areASML、Applied Materials、Lam Research、Tokyo Electron、KLA-Tencor、ASM International、SCREEN Semiconductor Solutions、ASM Pacific Technology、Hitachi High-TechandTeradyne, in whichASMLto24.6%The market share is the first. The top ten manufacturers in China's former process equipment market areASML、Applied Materials、Lam Research、Tokyo Electron、KLA-Tencor、ASM International, SMIC, SMIC International Integrated Circuit Manufacturing Co., Ltd. (hereinafter referred to as SMIC),ASM Pacific TechnologyandHitachi High-Tech, in whichASMLto28.9%The market share is the first. Chinese manufacturers in the micro-company.4.2%The market share ranks seventh and is the only domestic manufacturer to enter the top ten.

The top ten manufacturers in the global back-end packaging test equipment market areASM Pacific Technology、Besi、Kulicke & Soffa、Advantest、Teradyne、Cohu、Shinkawa、DISCO Corporation、ASM Assembly SystemsandNordson Corporation, in whichASM Pacific Technologyto21.8%The market share is the first. The top ten manufacturers in China's post-packaging test equipment market areASM Pacific Technology、Besi、Kulicke & Soffa、Advantest、Teradyne、Cohu、Shinkawa、DISCO Corporation、ASM Assembly SystemsandNordson Corporation, in whichASM Pacific Technologyto22.5%The market share is in the first place. Chinese manufacturers have not entered the top ten domestic manufacturers.

The top ten manufacturers in the global special application equipment market areAdvantest、Teradyne、Cohu、Xcerra Corporation、Chroma ATE、SPEA S.p.A.、Astronics Test Systems、Marvin Test Solutions、National InstrumentsandKeysight Technologies, in whichAdvantestto18.9%The market share is the first. The top ten manufacturers in China's special application equipment market areAdvantest、Teradyne、Cohu、Xcerra Corporation、Chroma ATE、SPEA S.p.A.、Astronics Test Systems、Marvin Test Solutions、National InstrumentsandKeysight Technologies, in whichAdvantestto19.2%The market share is in the first place. Chinese manufacturers have not entered the top ten domestic manufacturers.

according to champ consulting,2023The competitive landscape of the semiconductor equipment market will have the following changes:

Foreign manufacturers will still maintain their leading edge, but domestic manufacturers will accelerate their catch-up. Due to the high technical threshold of semiconductor equipment, long R & D cycle and high market concentration, foreign manufacturers will still maintain their leading edge in the semiconductor equipment market, especially in high-end products and key technologies. However, supported by national policies and stimulated by market demand, domestic manufacturers will accelerate technological innovation and industrial layout, improve product performance and quality, and expand market share, especially in low-end products and specific fields.

New competitors will emerge in the former process equipment market. As the former process equipment is one of the most core and key links in semiconductor equipment, its technical level and capacity scale directly affect the performance, quality and supply of semiconductor products. With the development and innovation of the semiconductor industry, the former process equipment is constantly updated and upgraded, developing towards higher precision, higher efficiency and lower cost. This will bring new technology demand and market opportunities, and will also attract new competitors to enter the former process equipment market, such as the lithography machine independently developed by fabs such as SMIC.

There will be more cooperation in the post-channel packaging test equipment market. Due to the progress and development of back-end packaging and testing technology, it is developing in the direction of high performance, high density, high reliability, low power consumption and low cost. This will bring more technical needs and market opportunities, and will also promote the cooperation and integration between the manufacturers of packaging and testing equipment to improve the technical level and market competitiveness. For example,ASM Pacific TechnologywithASM Internationalcooperation,Kulicke & SoffawithXcerra Corporationmerger, etc.

There will be more innovations in the special application equipment market. Due to the development and innovation of special application fields, the performance, quality and reliability of semiconductor products are required to be higher, and more professional and precise special application equipment is needed for manufacturing, testing and inspection. This will bring more technical needs and market opportunities, and will also promote innovation and competition among special application equipment manufacturers to improve technical level and market competitiveness. For example,Advantestinnovations in quantum computing, biomedicine,TeradyneInnovation in automotive electronics, industrial automation and other fields.

3.2 Display Device Equipment Market Competition Pattern Analysis

The competitive landscape of the display device equipment market is dominated by foreign manufacturers, but the market share of domestic manufacturers has increased. According to the data of Shangpu Consulting Group, the top ten manufacturers in the global front road process equipment market areCanon、Nikon、Applied Materials、SCREEN Semiconductor Solutions、Tokyo Electron、ULVAC、Hitachi High-Tech、ASM International、SFA Engineering CorporationandWonik IPS, in whichCanonto23.4%The market share is the first. The top ten manufacturers in China's former process equipment market areCanon、Nikon、Applied Materials、SCREEN Semiconductor Solutions、Tokyo Electron、ULVAC、Hitachi High-Tech、ASM International、SFA Engineering CorporationandWonik IPS, in whichCanonto24.1%The market share is in the first place. Chinese manufacturers have not entered the top ten domestic manufacturers.

The top ten manufacturers in the global back-end packaging test equipment market areASM Pacific Technology、Besi、Kulicke & Soffa、Advantest、Teradyne、Cohu、Shinkawa、DISCO Corporation、ASM Assembly SystemsandNordson Corporation, in whichASM Pacific Technologyto21.8%The market share is the first. The top ten manufacturers in China's post-packaging test equipment market areASM Pacific Technology、Besi、Kulicke & Soffa、Advantest、Teradyne、Cohu、Shinkawa、DISCO CorporationandASM Assembly Systems, in whichASM Pacific Technologyto22.5%The market share is in the first place. Chinese manufacturers have not entered the top ten domestic manufacturers.

The top ten manufacturers in the global special application equipment market areAdvantest、Teradyne、Cohu、Xcerra Corporation、Chroma ATE、SPEA S.p.A.、Astronics Test Systems、Marvin Test Solutions、National InstrumentsandKeysight Technologies, in whichAdvantestto18.9%The market share is the first. The top ten manufacturers in China's special application equipment market areAdvantest、Teradyne、Cohu、Xcerra Corporation、Chroma ATE、SPEA S.p.A.、Astronics Test Systems、Marvin Test Solutions、National InstrumentsandKeysight Technologies, in whichAdvantestto19.2%The market share is in the first place. Chinese manufacturers have not entered the top ten domestic manufacturers.

according to champ consulting,2023The competitive landscape of the display device equipment market will have the following changes:

Foreign manufacturers will still maintain their leading edge, but domestic manufacturers will accelerate their catch-up. Due to the high technical threshold of display device equipment, long R & D cycle and high market concentration, foreign manufacturers will still maintain their leading edge in the display device equipment market, especially in high-end products and key technologies. However, supported by national policies and stimulated by market demand, domestic manufacturers will accelerate technological innovation and industrial layout, improve product performance and quality, and expand market share, especially in low-end products and specific fields.

New competitors will emerge in the former process equipment market. As the front process equipment is one of the most core and key links in the display device equipment, its technical level and capacity scale directly affect the performance, quality and supply of display device products. With the development and innovation of the display device industry, the former process equipment is constantly updated and upgraded, developing towards higher precision, higher efficiency, lower cost and so on. This will bring new technology demand and market opportunities, and will also attract new competitors to enter the former process equipment market, such as the lithography machine independently developed by BOE and other panel factories.

There will be more cooperation in the post-channel packaging test equipment market. Due to the progress and development of back-end packaging and testing technology, it is developing in the direction of high performance, high density, high reliability, low power consumption and low cost. This will bring more technical needs and market opportunities, and will also promote the cooperation and integration between the manufacturers of packaging and testing equipment to improve the technical level and market competitiveness. For example,ASM Pacific TechnologywithASM Internationalcooperation,Kulicke & SoffawithXcerra Corporationmerger, etc.

There will be more innovations in the special application equipment market. Due to the development and innovation of special application fields, the performance, quality and reliability of display device products are required to be higher, and more professional and precise special application equipment is needed for manufacturing, testing and inspection. This will bring more technical needs and market opportunities, and will also promote innovation and competition among special application equipment manufacturers to improve technical level and market competitiveness. For example,Advantestinnovations in quantum computing, biomedicine,TeradyneInnovation in automotive electronics, industrial automation and other fields.

3.3 printed circuit board equipment market competition pattern analysis

The competition pattern of printed circuit board equipment market is dominated by foreign manufacturers, but the market share of domestic manufacturers has increased. According to the data of Shangpu Consulting Group, the top ten manufacturers in the global front road process equipment market areSchmoll Machines、Hitachi High-Tech、DISCO Corporation、Orbotech、SCREEN Semiconductor Solutions、Pluritec、Posalux、Manz AG、Shoda Techtron CorporationandATOTECH Germany GmbH, in whichSchmoll Machinesto14.8%The market share is the first. The top ten manufacturers in China's former process equipment market areSchmoll Machines、Hitachi High-Tech、DISCO Corporation、Orbotech、SCREEN Semiconductor Solutions、Pluritec、Posalux、Manz AG、Shoda Techtron CorporationandATOTECH Germany GmbH, in whichSchmoll Machinesto15.2%The market share is in the first place. Chinese manufacturers have not entered the top ten domestic manufacturers.

The top ten manufacturers in the global back-end packaging test equipment market areASM Pacific Technology、Besi、Kulicke & Soffa、Advantest、Teradyne、Cohu、Shinkawa、DISCO Corporation、ASM Assembly SystemsandNordson Corporation, in whichASM Pacific Technologyto21.8%The market share is the first. The top ten manufacturers in China's post-packaging test equipment market areASM Pacific Technology、Besi、Kulicke & Soffa、Advantest、Teradyne、Cohu、Shinkawa、DISCO Corporation、ASM Assembly SystemsandNordson Corporation, in whichASM Pacific Technologyto22.5%The market share is in the first place. Chinese manufacturers have not entered the top ten domestic manufacturers.

The top ten manufacturers in the global special application equipment market areAdvantest、Teradyne、Cohu、Xcerra Corporation、Chroma ATE、SPEA S.p.A.、Astronics Test Systems、Marvin Test Solutions、National InstrumentsandKeysight Technologies, in whichAdvantestto18.9%The market share is the first. The top ten manufacturers in China's special application equipment market areAdvantest、Teradyne、Cohu、Xcerra Corporation、Chroma ATE、SPEA S.p.A.、Astronics Test Systems、Marvin Test Solutions、National InstrumentsandKeysight Technologies, in whichAdvantestto19.2%The market share is in the first place. Chinese manufacturers have not entered the top ten domestic manufacturers.

according to champ consulting,2023The competitive landscape of the printed circuit board equipment market will have the following changes:

Foreign manufacturers will still maintain their leading edge, but domestic manufacturers will accelerate their catch-up. Due to the high technical threshold of printed circuit board equipment, long R & D cycle and high market concentration, foreign manufacturers will still maintain their leading edge in the printed circuit board equipment market, especially in high-end products and key technologies. However, supported by national policies and stimulated by market demand, domestic manufacturers will accelerate technological innovation and industrial layout, improve product performance and quality, and expand market share, especially in low-end products and specific fields.

New competitors will emerge in the former process equipment market. As the front process equipment is one of the most core and key links in printed circuit board equipment, its technical level and capacity scale directly affect the performance, quality and supply of printed circuit board products. With the development and innovation of the printed circuit board industry, the former process equipment is constantly updated and upgraded, and is developing in the direction of higher precision, higher efficiency, and lower cost. This will bring new technical requirements and market opportunities, and will also attract new competitors to enter the former process equipment market, such as direct molding independently developed by printed circuit board factories such as Huatian Technology (DMP), etc.

There will be more cooperation in the post-channel packaging test equipment market. Due to the progress and development of back-end packaging and testing technology, it is developing in the direction of high performance, high density, high reliability, low power consumption and low cost. This will bring more technical needs and market opportunities, and will also promote the cooperation and integration between the manufacturers of packaging and testing equipment to improve the technical level and market competitiveness. For example,ASM Pacific TechnologywithASM Internationalcooperation,Kulicke & SoffawithXcerra Corporationmerger, etc.

There will be more innovations in the special application equipment market. Due to the development and innovation of special application fields, the performance, quality and reliability of printed circuit board products are required to be higher, and more professional and precise special application equipment is needed to manufacture, test and inspect. This will bring more technical needs and market opportunities, and will also promote innovation and competition among special application equipment manufacturers to improve technical level and market competitiveness. For example,Advantestinnovations in quantum computing, biomedicine,TeradyneInnovation in automotive electronics, industrial automation and other fields.

4. Analysis of Opportunities and Challenges in the Electronic Special Equipment Market

Market Opportunity Analysis of 4.1 Electronic Special Equipment

according to champ consulting,2023The main opportunities facing the electronic special equipment market in are as follows:

National policy support. In order to promote the development and innovation of the electronic information industry, the state has issued a series of policies and measures, such as the National Integrated Circuit Industry Development Promotion Outline, the National Printed Circuit Board Industry Development Promotion Outline, and the National Display Device Industry Development Promotion Outline. It provides policy guidance, financial support, tax incentives, and talent training support for the electronic special equipment industry. These policies and measures will be conducive to the development and growth of the electronic equipment industry.

Innovation of new technologies. With the progress and innovation of science and technology, the electronic information industry is constantly emerging new technologies and new applications, such5G, Internet of things, artificial intelligence, new energy vehicles, etc., these technologies and applications put forward higher requirements for the performance, quality and reliability of electronic products, and also drive the innovation and upgrading of electronic special equipment technology. For example, in the field of semiconductor equipment, extreme ultraviolet lithography (EUV), atomic layer deposition (ALD), atomic layer etching (ALE) and other advanced technologies; in the field of display device equipment, flexible display (Flexible Display), foldable display (Foldable Display), wearable display (Wearable Display) and other advanced technologies; in the field of printed circuit board equipment, direct molding (DMP), laser direct imaging (LDI), microporous drilling (MLD), micropore filling (MVF), embedded components (ECP) and other advanced technologies. These technological innovations will bring new market opportunities and development space for the electronic special equipment industry.

Expansion of new applications. With the development and changes of society, the electronic information industry has also continuously expanded new application fields and new market demands, such as aerospace, national defense, medical equipment, smart home, etc. These applications require higher performance, quality and reliability of electronic products, and require more professional and sophisticated electronic equipment to manufacture, test and inspect. These application expansion will bring new market opportunities and development space for the electronic special equipment industry.

4.2 Electronic Special Equipment Market Challenge Analysis

according to champ consulting,2023The main challenges facing the electronic special equipment market in are as follows:

International trade friction. Due to the impact of Sino-US trade frictions, the United States has imposed a series of restrictions and sanctions on China's electronic products and technologies, such as export controls on Huawei, ZTE, SMIC and other enterprises, and embargoes on China's semiconductor equipment and materials. These restrictions and sanctions have caused certain impacts and difficulties on China's electronic information industry, and also brought certain pressures and challenges to China's electronic special equipment industry.

Technical barriers. Due to the high technical threshold of electronic special equipment, long R & D cycle and high market concentration, foreign manufacturers have strong technical and market advantages in the field of electronic special equipment, especially in high-end products and key technologies. Foreign manufacturers protect their technological and market advantages through technical barriers, patent barriers, standard barriers, etc., and hinder the technological innovation and market entry of domestic manufacturers. These technical barriers have caused certain constraints and challenges to China's electronic equipment industry.

Lack of talent. Due to the high technical threshold of electronic special equipment, long R & D cycle and high market concentration, the demand for talents in the electronic special equipment industry is also very high, and talents with strong professional knowledge, innovation ability and practical experience are needed. However, at present, China's talent training and reserve in the field of electronic special equipment is still insufficient, and there is a lack of high-level R & D talents, management talents and marketing talents. The lack of these talents has caused certain constraints and challenges to China's electronic equipment industry.

Conclusion

To sum up,2023The electronic special equipment market is a market full of opportunities and challenges. It requires electronic special equipment manufacturers to continue to innovate and forge ahead, improve their technical level and market competitiveness, seize opportunities, respond to challenges, and achieve sustainable development.